Hard Bond #16/20 Double Zigzag Segment
Premium quality hard metal bond diamond segments #16/20 for adhesive and coating removal, very coarse grinding. Maximise removal rates without excessive damage to the underlying substrate.
High quality raw materials including tungsten carbide powder to maximise performance.
Precise process of weighing, and cold pressing to make the highest quality segments.
The hard bond is sintered in advanced vacuum furnaces creating a controlled environment with more versatility for high temperature sintering, essential for achieving desired purity, density, and strength of each segment.
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