Medium Bond #16/20 Zigzag Segment

Premium quality medium metal bond diamond segments #16/20 for adhesive and coating removal, coarse grinding. Maximise removal rates without excessive damage to the underlying substrate.

• Ø150mm 

• Arbor 19mm

• Wet or dry use

• High quality raw materials including tungsten powder to maximise performance.

• Precise process of weighing, and cold pressing to make the highest quality segments.

• The medium bond is sintered in advanced vacuum furnaces creating a controlled environment with more versatility for high temperature sintering, essential for achieving desired purity, density, and strength of each segment.