Very Soft Bond #16/20 Zigzag Segment Low Profile

Premium quality very soft metal bond diamond segments #16/20 for adhesive and coating removal, very coarse grinding. Maximise removal rates without excessive damage to the underlying substrate.

• Ø150mm. 

• Arbor 19mm.

• Low profile 6mm segments.

• 6 segment configuration allowing increased pressure exerted to each individual segment for aggressive material removal. 

• Concrete, terrazzo, cementitious overlays and natural stone.

• High quality raw materials to maximise performance.

• Precise process of weighing, and cold pressing to make the highest quality segments.

• The very soft bond is sintered in special inert gas furnaces creating a controlled environment with more versatility for low temperature sintering, essential for achieving desired purity, density, and strength of each segment.